number of aerospace, defence, communications and space products. The advanced processing capability enables processing of a large range of materials and Metallisation. Previous designs have seen circuits fabricated on a number of substrates including Alumina, high performance/high dielectric Ceramics, Glass, Silicon, Ceramic-Silicon-Carbide, and Synthetic CVD Diamond. Metallisation schemes include Titanium/Tungsten (TiW) , Gold, Platinum , Silver, Nickel, Titanium and Chromium with Tantalum Nitride Resistors and plating of Gold, Nickel and Copper. Circuit features include track...